A substrate that solves the issue that copper cannot be used for wiring as a result of high cost of alumina substrate and sintering at superior temperature. Glass is combined with ceramic and fired in a small temperature of 800 ° C.

Therefore, copper is often used for wiring. It is actually also probable to manufacture passive parts this kind of as coils and capacitors in the board by benefiting from the traits of very low coefficient of thermal enlargement and great insulation properties.

It has been replaced by having an alumina substrate being a substrate for high-frequency circuits as well as a substrate for high-frequency modules. Thermal conductivity is inferior to alumina substrates.

Composite board

A paper epoxy board is fashioned on both sides of the glass epoxy board. Straightforward to procedure and more affordable than glass epoxy substrate by itself. In recent times, composite substrates applying Teflon on each side have been produced for high-frequency circuits. It can be fewer high priced than Teflon substrates and it has far better frequency properties than glass epoxy substrates.

Halogen-free substrate

A multilayer board that has exactly the same structure to be a glass epoxy board but won't include halogen-based flame retardants such as fluorine , chlorine , bromine , and iodine . Toxic substances produced all through recycling and incineration may be suppressed. When a halogen-free resist is made use of in the exact same time, the substrate becomes bluish. Even so, there exists also a green halogen-free resist.

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